| 摘要 |
PURPOSE: A structure of a tool for forming process for manufacturing a semiconductor package is provided to prevent a spring-back phenomenon by improving a structure of a punch and a structure of a die. CONSTITUTION: A lead(310) is projected from a package body(300). A die(2) has a support projection(210) for supporting the lead(310). The lead(310) is bent by using a punch for pressing the lead(310) toward an outer side of the support projection(210). Namely, the lead(310) is formed along an outline of the die(2) if the lead(310) is pressed by the punch. The first bent portion is formed by the bending process. The second bent portion is formed by bending the lead(310) corresponding to an opposite portion to a bent portion of the lead(310) of a package(3). An elastic return force of the first bent portion is reduced by the second bent portion. A projection portion(100) is formed in the second bent portion of the lead(310).
|
