| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which has improved reliability in the electrical connection between a semiconductor device and a wiring board so that the cracking in an insulating layer is prevented even if heat is repeatedly applied for a long period due to the operation of the semiconductor device and the change of the ambient temperature used, etc. <P>SOLUTION: A first and a second conductor layers 2a, 2b used for grounding or power supply are adjacently disposed within the first layer of insulating layers 1b. A third and a fourth conductor layers 2c, 2d used for grounding or power supply are adjacently disposed within the second layer of the insulating layers 1b. The gap G1 and G2 between the conductor layers 2a, 2b and 2c, 2d are so disposed that they do not overlap in the plan view, respectively. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
