发明名称 |
Board on chip package and method of manufacturing the same |
摘要 |
A ball grid array type board on chip package may include an integrated circuit chip having an active surface that supports a plurality of contact pads. An interposer may be adhered to the active surface of the integrated circuit chip. At least one hole may be provided through the interposer to expose the contact pads. A board, which may have a first surface supporting a plurality of metal lines, may have a second surface adhered to the interposer. The board may have an opening through which the contact pads may be exposed. A plurality of bonding wires may connect the contact pads to the metal lines through the opening.
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申请公布号 |
US2007096341(A1) |
申请公布日期 |
2007.05.03 |
申请号 |
US20060430900 |
申请日期 |
2006.05.10 |
申请人 |
CHUNG HYUN-SOO;JANG DONG-HYEON;LEE DONG-HO;LEE IN-YOUNG |
发明人 |
CHUNG HYUN-SOO;JANG DONG-HYEON;LEE DONG-HO;LEE IN-YOUNG |
分类号 |
H01L23/52 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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