Laser ablation process for manufacturing submounts for laser diode and laser diode units

摘要

A method for manufacturing submounts for laser diodes includes the steps of providing a base configured with a ceramic carrier and a metal layer deposited upon the substrate. The method further includes using a pulsed laser operative to generate a plurality of pulses which are selectively trained at predetermined pattern on the metal layer's surface so as to ablate the desired regions of the metal layer to the desired depth. Thereafter the base is divided into a plurality of submounts each supporting a laser diode. The metal layer includes a silver sub-layer deposited upon the ceramic and having a thickness sufficient to effectively facilitate heat dissipation.

主权项

1. A method for manufacturing laser diode units, comprising:
providing a base including a ceramic carrier and a metal layer on the ceramic carrier; generating a plurality of laser light pulses while controlling a laser beam parameter which is selected from the group consisting of a pulse repetition rate, pulse duration, beam output power, linear speed and number of passes and a combination thereof; training laser light pulses at a predetermined pattern on a metal layer surface, thereby ablating the metal layer so as to form a plurality of ablated regions each having a desired depth while causing accumulation of burrs on the metal layer surface next to respective ablated regions; dicing the ceramic carrier with a cutting saw, thereby producing a plurality of submounts; and soldering an inner surface of a high power laser diode to each submount, wherein the laser beam parameter is controlled so that the burrs do not extend beyond an outer surface of the soldered laser diode.