| 摘要 |
The objects of this invention are to offer a compact, low height, low cost, and high reliability acoustic surface-wave device, and its manufacturing method. In order to accomplish the objects of the invention, the invented acoustic surface-wave device is constituted of a substrate (101), comb-electrode (102) disposed on the main surface of said substrate plural electrode pads (103) disposed around said comb-electrode, protecting means (112) covering said comb-electrode through a closed space produced by combining said comb-electrode and said plural electrode pads with said substrate by using substantially covalent bonding force acted between, conductive bumps (104) formed on said plural electrode bumps, a conductive adhesive layer (105) disposed at least on the top of said conductive bumps, and a package (107) adhered on said conductive bumps by means of said conductive adhesive, and insulation adhesive filled into said package contacting with said conductive adhesive, said conductive bumps, and said protective means. <IMAGE> |
