发明名称 APPARATUS FOR MANUFACTURING SEMICONDUCTOR
摘要 PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a semiconductor where a spin and a head can be easily clamped. SOLUTION: This apparatus comprises the rotatable spin 120, the head 110 separatably clamped to the spin 120, and a clamp member 130 for clamping the spin 120 and the head 110 mutually by clamping the outer circumferential surfaces of the spin 120 and the head 110 simultaneously. The clamp member 130 comprises a ring-shaped clamping frame 132 formed so as to surround the outer circumferential surfaces of the spin 120 and the head 110, a protrusion 134 provided in one end of the clamping frame 132, a lever 136 pivotably installed in the other end of the clamping frame 132, and a fastener 138 that has one end pivotably installed on the lever 136 and the other end hanging over the protrusion 134.
申请公布号 JP2002203820(A) 申请公布日期 2002.07.19
申请号 JP20010376080 申请日期 2001.12.10
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 BAE GI-SUNG;KIN MINKEI
分类号 H01L21/304;B24B45/00;(IPC1-7):H01L21/304 主分类号 H01L21/304
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