POLISHING METHOD, POLISHING MACHINE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a polishing method and a polishing machine which have low running cost, have small pattern width dependence and generate no working damages. SOLUTION: The polishing machine is provided with a grindstone which is made of abrasive grains and a bonding resin for bonding them, and has the modulus of elasticity ranging from 5 to 500 kg/mm<2> . For planarizing the surface 31 having unevenness of a substrate, the surface is polished by a polishing tool 11L having a small modulus of elasticity, and then is polished by a polishing tool 11L having a large modulus of elasticity.