| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition preventing or sufficiently reducing film sticking during pattern formation or the like and to provide a solder resist, an inter-layer insulating material, or a flexible substrate which includes a hardened material of the photosensitive resin composition.SOLUTION: The photosensitive resin composition includes: a resin (A) which is obtained by adding an epoxy group-containing unsaturated compound to a part of a carboxyl group of a polymer having the carboxyl group in its side chain and has, in its side chain, a bivalent organic group expressed by general formula (I): -Y-CO-X-C(O)O- (in the formula, X represents an organic group containing at least one aromatic ring and Y represents -(RO)n-(C(O)(CH)mO)- or -OR-(OC(O)-R)o-(OC(O)O-R)p-O- where R, R, R, and Reach independently represent an alkylene group with 2 to 8 carbon atoms, n represents an integer of 1 to 15, m represents an integer of 3 to 10, l represents an integer of 0 to 10, and o represents an integer of 0 to 10, and p represents an integer of 1 to 10); a photoinitiator (B); and a multifunctional epoxy compound (C) having two or more epoxy groups in a molecule. |
