发明名称 LIQUID-COOLED INVERTER ASSEMBLY
摘要 An inverter assembly includes a housing and a substrate disposed in the housing. The substrate includes at least a first conductive layer patterned to include an alternating current (AC) path and a direct current (DC) path. A plurality of inverter switches is mounted on the substrate and electrically coupled to the AC path and the DC path.
申请公布号 US2009154101(A1) 申请公布日期 2009.06.18
申请号 US20070959176 申请日期 2007.12.18
申请人 GM GLOBAL TECHNOLOGY OPERATIONS, INC. 发明人 KORICH MARK D.;SMITH GREGORY S.;JOHN GEORGE;TANG DAVID;CONROY KARL D.
分类号 H05K7/20;H05K7/02 主分类号 H05K7/20
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