| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor substrate holder which can uniformly polish the entire surface of a semiconductor substrate, and also to provide a machine equipped with the holder for polishing a semiconductor substrate. SOLUTION: A semiconductor substrate holder 20 has a movable plate mounted expandably inside a holder body 22. Polishing operation can be executed by a semiconductor substrate holder 20 in two fundamental processing modes, corresponding to two different end positions of the movable plate in a vertical direction. The plate 23 remains contacted mechanically with a substrate 12 in the first (lower direction) mode, air cushion is generated in a chamber 29 between the plate 23 for pressing the substrate 12 on a polishing pad 11 and the substrate 11 in the other second (upper direction) mode. |
