| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic circuit board and an electronic apparatus which improve the heat radiation performance.SOLUTION: A ceramic circuit board includes: a multilayer substrate; surface layer metal circuit boards 3 joined to an upper surface or a lower surface of the multilayer substrate with a brazing material 2; and inner layer metal circuit boards 4 and metal poles 5 which are provided in the multilayer substrate. The multilayer substrate includes multiple ceramic substrates 1 and metal plates 11 provided between the multiple ceramic substrates 1. Each metal plate 11 has circuit through holes 11a. The multiple ceramic substrates 1 and the metal plates 11 are joined to each other by the brazing material. The inner metal circuit boards 4 are respectively provided in the circuit through holes 11a. The metal poles 5 are respectively disposed in through holes 1a formed in the multiple ceramic substrates 1 and respectively have first end parts, joined to the inner layer metal circuit boards 4 with the brazing material, and second end parts, joined to the surface layer metal circuit boards 3 with the brazing material. |
