| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method and a semiconductor device, which can inhibit increase in cost caused by manufacturing of molds and reduce a management burden of the molds.SOLUTION: A semiconductor device manufacturing method comprises the steps of: providing on a lead frame 40, a covering member 47 for partially covering a plurality of leads 5 of the lead frame 40 including a plurality of die pads 3 and the plurality of leads 5; arranging a semiconductor chip 2 on each die pad 3; electrically connecting the leads 5 and the semiconductor chip 2 via bonding wires 4; arranging the lead frame 40 in a mold 50 and casting an encapsulation resin 6 into the mold 50 to form an encapsulation structure 55 where the plurality of semiconductor chips 2 are collectively encapsulated; removing an upper covering member 45, a lower covering member 46 and the encapsulation resin 6 which covers the covering members; and selectively cutting the encapsulation structure 55 to cut out individual pieces of semiconductor devices 1.SELECTED DRAWING: Figure 10 |
