| 摘要 |
PROBLEM TO BE SOLVED: To reduce the breakage, chipping, etc., of a wafer by a method wherein specific quantities of two kinds of diamond particles which contain extra-fine particles and whose average particle diameters are different from each other are mixed and contained in a whetstone. SOLUTION: In the beveling process of a wafer 1, the circumferential edge of the wafer 1 is pressed against a rotating whetstone 2 such as a trapezoidal whetstone while the wafer 1 is made to rotate to bevel the edge. A beveling angle is about 22±5 deg.. A whetstone which contains 5-30wt.% of extra-fine diamond particles whose average particle diameter is 3-18μm and, further, contains 70-95wt.% of diamond particles whose average particle diameter is 5-30μm is used in the whetstone 2 for beveling. By using the whetstone in the beveling process, the dimension of a broken layer produced by the beveling can be suppressed to be less than several microns while the grinding capability can be maintained, so that a strong wafer which has an excellent mechanical strength and heat-resistant propeties can be obtained.
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