| 摘要 |
PROBLEM TO BE SOLVED: To prevent electrical characteristics of a wiring film from being damaged, while maintaining the evenness of the surface of the wiring film is in a process wherein the wiring film is embedded. SOLUTION: Grooves 5a and 5b for embedded wiring are formed in an inter- layer insulation film IL formed on a substrate 1, then a barrier metal film 6 and a wiring film 7 are laminated on the inter-layer insulation film IL and in the grooves 5a and 5b, and a protective film PL is formed over the whole surface of the wiring film 7. Then the protective film PL is left only in a hollow H1 in, for example, a CMP(chemical-mechanical polishing) method, and with it as a cover, the wiring film 7 is etched isotropically. Thereby the surface of the wiring film 7 arranged to be the same height as the bottom of the hollow H1, so that the surface is flattened. After this, the protective film PL is removed, and the wiring film 7 and the barrier metal film 6 over an inter-layer insulation film 4 are removed. Then a second inter-layer insulation film is formed over the whole surface.
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