| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a substrate holding device capable of preventing occurrence of bending of a substrate and restricting occurrence of particles. SOLUTION: A center part of a wafer W is held by a central holding part 81 by vacuum-chucking, and a circumferential part of the wafer W is not supported by a circumferential support member 88, and a circumference of the wafer W is slightly bent by gravity. A discoidal member 87, namely the circumferential support member 88 is moved to an upside support position, and a height of an upper end face of the central holding part 81 conforms to a height of an upper end face of each of the circumferential support members 88. Thus, the entire wafer W is flatly supported. Next, a vacuum-chucking by the circumferential support members 88 is started, and a circumferential part of the wafer W is chucked and held. Next, the wafer W is transferred to a suitable observation position on a horizontal face together with a stage 8.</p> |
