发明名称 COMPOSITE CIRCUIT MODULE AND HIGH-FREQUENCY MODULE DEVICE
摘要 There is provided composite circuit module of small size in which its first and second circuit portions having different pass bands are reliably electro magnetically shielded. The composite circuit module is formed as follows: a first and the second element (3, 4) are mounted on at least one principal surface of a ceramic multilayer board (2). The first and the second element (3, 4) constitute a part of the first and the second circuits having different pass bands. Inside the ceramic multilayer board (2), a first circuit wiring portion constituting the first circuit and a second circuit wiring portion constituting the second circuit are provided at different height positions. A first and a second ground electrode (14, 15) are disposed above and below the first circuit wiring portion, and a third and a fourth ground electrode (25, 14) are disposed above and below the second circuit wiring portion. The first and the second element (3, 4) are mounted on a first and a second element region (A, B) provided on at least one principal surface of the ceramic multilayer board (2).
申请公布号 WO2007049375(A1) 申请公布日期 2007.05.03
申请号 WO2006JP311592 申请日期 2006.06.09
申请人 MURATA MANUFACTURING CO., LTD.;WATANABE, KUNIHIRO 发明人 WATANABE, KUNIHIRO
分类号 H01L25/00;H01L23/13 主分类号 H01L25/00
代理机构 代理人
主权项
地址