| 摘要 |
PROBLEM TO BE SOLVED: To ensure bonding property of bonding in a method of electrically connecting electronic components through conductors formed by wire bonding. SOLUTION: Prior to making electrical connection of a first conductor 3a to a second conductor 4 through wire bonding, a bump 6 is formed on the second conductor 4 to be a sec. side of wire bonding, such that a ball 5a is formed at the top of a capillary 7, and the capillary 7 is moved to make contact with the ball 5a to the second conductor 4 and is further moved vertically with respect to the surface of the second conductor 4 and horizontally at the same time, to make the ball 5a compression bond to the second conductor 4, whereby the ball 5a can be bit into embossed parts of grain lumps 4a of the second conductor 4 by the top end of the capillary 7 and the bond property can be improved by increase in the bond area and the anchoring effect. |
