| 摘要 |
PROBLEM TO BE SOLVED: To improve the alignment accuracy between an exposure original and an exposure object, by observing an exposure object-side alignment mark formed first on the exposure object through an exposure original side alignment mark, and then collating the two marks with each other. SOLUTION: A reticle 50, which is an exposure original, has a blank 51 formed in the shape of flat plate using quartz glass or the like, and an original image 52 and a reticle-side mark 55 as an exposure original side alignment mark are formed on a main surface of the blank 51. A wafer-side alignment mark formed on a wafer, which is an exposure object, is observed through the reticle-side mark 55, and the wafer-side alignment mark and the reticle-side mark 55 are collated with each other. Thus, since alignment between the reticle 50 and the wafer can be carried out directly, the accuracy of alignment can be significantly improved. |
