发明名称 Bonding of micro-bodies for a micro-system, has adhesive in the form of adhesive threads laid at the bonding surfaces to be activated by heat when the bodies are pressed together
摘要 <p>In a micro-technological technique, an adhesive (8) is applied to the bonding zones (5) to form an adhesive bond between two bodies (2). The adhesive is at least one adhesive thread (13), activated by heat, with a defined cross-section laid along the bonding zones (5). At least one adhesive thread (13) is of a thermoplastic material or a metal alloy, of glass solder or a reactive adhesive material. At least one adhesive thread (13) is laid in the bonding zones (5) while it is not in an adhesive state. At least one adhesive thread (13) is supported by a holder structure (22) at a slight gap from the surfaces (2') to be bonded, and at least one thread (13) is laid in contact with the bonding surfaces. At least one adhesive thread (13) to bond a number of framed zones (4), by the adhesive (8), uses at least one body (2) laid over it with an intersecting configuration. At least one adhesive thread (13) is laid separately, and one or more threads are laid in a cohesive grid structure. At least one adhesive thread (13) is laid in a groove (33) formed by the micro-structure of the body (2) at the bonding zones (5). The grooves (33) have recesses to accommodate any surplus adhesive released by the heat bonding action. When the bonding surfaces of both bodies have been covered with the adhesive, they are pressed together and heated, to activate the adhesive and bond the surfaces together. The laid adhesive threads (13) can be secured in place at the bonding surfaces by local heat, to keep them in position for bonding the two bodies together. The laid adhesive threads (13) are also held in place by pin holders (22) outside the bonding area, with the threads wound round them. The adhesive is a single adhesive thread (13) which is laid over the bonding surfaces and/or a number of separate bonding threads. An Independent claim is included for an apparatus to bond two bodies together, with a holder to take one body (2) in a release mounting. A laying unit places at least one adhesive thread (13) along one bonding surface (2') at the body. A second holder carries the other body in a release mounting. A clamp presses both holders together, with their fitted bodies, so that the bonding surfaces of both bodies are in contact with each other. A heater heats both bodies, including the adhesive threads (13) at the bonding surfaces between them.</p>
申请公布号 DE19850041(A1) 申请公布日期 2000.05.04
申请号 DE1998150041 申请日期 1998.10.30
申请人 FESTO AG & CO 发明人 POST, PETER;MUTH, ANDREAS;VOLLMER, HERBERT;WEINMANN, MICHAEL;LUTZ, GERHARD;DOMMANN, ALEX;LIPPUNGER, URS
分类号 B29C65/00;B29C65/02;B29C65/50;B29C65/52;C09J5/06;F16B11/00;(IPC1-7):C09J5/00;C03C29/00 主分类号 B29C65/00
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