Wafer level hermetically sealed MEMS device

摘要

A hermetically sealed microelectromechanical system (MEMS) package includes a MEMS switch having a movable portion and a stationary portion with an electrical contact thereon. A glass lid is anodically bonded to the MEMS switch to form a sealed cavity over the movable portion of the MEMS switch. The glass lid includes a contact aperture to allow access to the electrical contact on the stationary portion of the MEMS switch. A family of body-implantable hermetically-sealed MEMS packages are provided according to certain aspects and embodiments of the present invention.