| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the warpage of a printed wiring board after heat treatment without deteriorating the performance of a product and by minimizing process losses by contriving a conductor pattern formed on the board. <P>SOLUTION: The printed wiring board is equipped with a substrate 2 composed of an insulator, a strip line 1 provided on the surface of the substrate 2, and a ground metallic layer 3 provided on the rear surface of the substrate 2. Openings 4 are formed through the metallic layer 3 to reach the substrate 2. A converter and an antenna device for receiving radio wave are equipped with the printed wiring board. <P>COPYRIGHT: (C)2003,JPO |
