摘要 |
Robotic apparatus (24) may be provided for handling workpieces such as semiconductor wafers (44) within an integrated vacuum processing system (20) and may be mounted within a vacuum load lock chamber (34) adjacent a plurality of vacuum processing chambers (26, 28, 30, 32). The apparatus (24) includes an upper arm (38), a forearm (82), an end effector (54) for supporting a wafer (44) to be transported, and a wrist (144) connecting the forearm (82) to the end effector (54). The upper arm (58) is rotatable in a level plane about an upright shoulder axis (68) adjacent its inner end (62). A first coupling mechanism interconnects the forearm (82) to the upper arm (58) for mutual rotation about an elbow axis (76) in a level plane. An end effector (54) serves to support a wafer (44) to be transported and a wrist (144) connects the forearm (58) to the end effector (54) distant from the elbow axis (76). A second coupling mechanism interconnects the forearm (82) to the wrist (144) for their mutual rotation in a level plane about a wrist axis (142). Rotation of the upper arm (58) moves the end effector (54) between a retracted position and an extended position distant from the retracted position along a substantially straight line of travel and without change in its azimuthal orientation. |