| 摘要 |
A heater assembly is provided to prevent the clogging of a substrate chucking line hole by improving a pumping ability using one cylinder type O-ring for contacting a substrate chucking line capable of increasing inner diameters of the O-ring and the substrate chucking line. A heater assembly includes a body for loading a wafer, a vacuum line for chucking the wafer in the body, a heater support unit(123) for supporting the body under the body, a substrate chucking line, a flange, a substrate chucking line hole and a cylinder type O-ring. The substrate chucking line(121) is connected with the vacuum line at an inner portion of the heater support unit. The flange(130) is arranged at a lower end portion of the heater support unit to isolate the inner portion of the heater support unit from the outside. The substrate chucking line hole(131) is formed through the flange. The cylinder type O-ring(O) is arranged in the substrate chucking line hole. The cylinder type O-ring has the same inner diameter as that of an end portion of one side in the substrate chucking line.
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