| 发明名称 |
Semiconductor package assembly |
| 摘要 |
Embodiments of the present disclosure provide an apparatus comprising a substrate having (i) a first side configured to receive a semiconductor die and (ii) a second side disposed opposite to the first side. The substrate comprises a printed circuit board material. The apparatus further comprises an interposer that is (i) disposed in the substrate and (ii) configured to electrically couple the first side of the substrate and the second side of the substrate. The interposer comprises a semiconductor material. |
| 申请公布号 |
US9397036(B1) |
申请公布日期 |
2016.07.19 |
| 申请号 |
US201514739699 |
申请日期 |
2015.06.15 |
| 申请人 |
Marvell International Ltd. |
发明人 |
Sutardja Sehat |
| 分类号 |
H01L23/495;H01L23/498;H01L23/00 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus comprising:
a substrate having (i) a first side configured to receive a semiconductor die, and (ii) a second side opposite to the first side; an interposer disposed in the substrate, wherein the interposer has (i) a first side, (ii) a second side that is opposite to the first side of the interposer, and (iii) a third side that is perpendicular to the first side of the interposer; and a connector that is at least in part disposed one or both of (i) through the interposer and (ii) on the third side of the interposer, wherein the connector is configured to electrically couple the semiconductor die and the second side of the substrate. |
| 地址 |
Hamilton BM |
