| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface acoustic wave device which hardly causes short- circuit between mounting electrodes in mounting of an elastic surface wave element, even devised to be miniaturized, and facilitates checking the formation of fillets of a conductive bond in mounting, thus reducing the cost, with the element being mounted on a board and sealed with a resin-sealing layer. <P>SOLUTION: The surface acoustic wave device 1 has a surface acoustic wave element 3, which is mounted on a multilayer board 2 by the face down method using bumps 19a, 19b and sealed with a resin-sealing layer 4. Electrode lands 16, 17 on the upper side 2a of the multilayer board 2 connected to the bumps 19a, 19b are connected to inner electrodes 22, 23 via electrodes 20a, 20b, and the inner electrodes 22, 23 are electrically connected to mounting electrodes 24, 25 on the lower side of the board 2 and to end-face wiring electrodes 26, 27. <P>COPYRIGHT: (C)2003,JPO |
