| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a cutting method by which a board can be cut along a fine pattern. <P>SOLUTION: The second harmonic wave of a laser beam generated by using a solid dielectric including ions as a laser medium is made incident on a surface of the board. The board is cut while at least one of a beam spot or the board is made to move so that the beam spot moves on the surface of the board. By converging the beam spot small, the board can be cut along a fine pattern. <P>COPYRIGHT: (C)2003,JPO</p> |
