Chip-embedded printed circuit board and semiconductor package using the PCB, and manufacturing method of the PCB

摘要

A chip-embedded printed circuit board (PCB), a semiconductor package using the PCB, and a manufacturing method of the chip-embedded PCB. The semiconductor package using a chip-embedded printed circuit board (PCB) includes upper and lower semiconductor packages having a package on package (PoP) structure, wherein the lower semiconductor package includes a base substrate including predetermined circuit patterns formed therein; an electronic component electrically connected to the circuit pattern and embedded in the base substrate such that one surface thereof is exposed to an upper surface of the base substrate; and a heat dissipation member installed on an exposed surface of the electronic component to dissipate heat generated from the electronic component to the outside.

主权项

1. A semiconductor package using a chip-embedded printed circuit board (PCB), the semiconductor package comprising:
a lower semiconductor package; and an upper semiconductor package stacked on the lower semiconductor package, wherein the lower semiconductor package comprises: a base substrate comprising circuit patterns formed therein; an electronic component electrically connected to the circuit patterns and embedded in the base substrate such that only one surface of the electronic component is exposed to an upper surface of the base substrate and the one surface is substantially entirely exposed to the upper surface of the base substrate; and a heat dissipation member directly in contact with substantially a whole of the exposed surface of the electronic component to dissipate heat generated from the electronic component to the outside, wherein the heat dissipation member is exposed to a gap between the upper semiconductor package and the lower semiconductor package.