An image sensor is provided. The image sensor comprises: a pixel array chip and a logic chip which are vertically stacked; and an insertion layer which is arranged between the pixel array chip and the logic chip. The insertion layer comprises: a connection unit configured to electrically connect the pixel array chip to the logic chip; a shielding unit configured to suppress an electrical coupling between the pixel array chip and the logic chip; and a metal diffusion preventing film arranged adjacently to the connection unit and the shielding unit and configured to prevent metal from being diffused in the connection unit and the shielding unit.
