| 摘要 |
A one-chip type RF(Radio Frequency) integration module is provided to realize each circuit element which constitutes an RF end as one package element, thereby minimizing a mounting area on a substrate as obtaining a degree of freedom on arrangement design of modules comprised for another functions and reducing a mounting process of the elements. The first substrate layer(L1) becomes a single module by comprising as follows. A front end module(110) separates multiple bands of transceiving signals to filter the separated signals. A power amplification module(130) amplifies transmission signals to deliver the amplified signals to the front end module(110). A transceiver module(140) mutually converts baseband signals and RF(Radio Frequency) signals to process the converted signals. A matching circuit module(120) matches impedance between the transceiver module(140) and the front end module(110).
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