| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal conductive substrate for electrically connecting a printed circuit board coming with a power semiconductor and a control circuit, and capable of efficiently distributing heat of the power semiconductor and making the heat hard to flow into the control circuit.SOLUTION: A thermal conductive substrate comprises a lead frame, and a first heat dissipator including a first recess which can house an electronic component connected to the rear surface side of the lead frame. A thermally conductive member is filled between the electronic component of the first recess and the first heat dissipator. The control circuit which controls the electronic component is mounted on a printed circuit board mounted on the surface side of the lead frame.SELECTED DRAWING: Figure 1 |
