| 摘要 |
PROBLEM TO BE SOLVED: To provide a new thermal transfer device that can improve a yield of a transfer film.SOLUTION: In the thermal transfer device is formed a work chamber closed by abutting an edge of an opening part of a first chamber member 10 to an edge of an opening part of a second chamber member 20, where the work chamber is partitioned into a first chamber near the first chamber member 10 and a second chamber near the second chamber member 20 by interposing a transfer film 300 between the first chamber member 10 and the second chamber member 20, and the transfer film 300 is transferred thermally to a transferred object arranged in the first chamber member 10 and then the transfer film 300 is cut on the opening part of the first chamber member 10, by suctioning air existing in the work chamber and further by making inner pressure in the second chamber to be positive pressure relative to inner pressure in the first chamber. |
