EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

摘要

Disclosed is an epoxy resin composition for semiconductor encapsulation essentially containing an epoxy resin, a phenol resin, a curing accelerator and an inorganic filler which is characterized in that a spherical molten silica having a pH of not less than 3 and not more than 5 as well as an eutectic material composed of silicon dioxide and titanium oxide or an eutectic material composed of silicon dioxide and alumina are contained as components of the inorganic filler. This epoxy resin composition is excellent in fluidity and moldability.