| 摘要 |
The method involves utilizing a stamp (4) having a similar coefficient of thermal expansion as that of a substrate (1) e.g. aluminum. The stamp and the substrate are heated to a temperature at which a moldable film (2) becomes soft before pressing the stamp against the film. The stamp and the substrate are cooled at a temperature at which the film becomes hard, and the stamp is removed from the substrate. An Independent claim is also included for a stamp for transferring a pattern provided on stamp to a substrate. |
