| 摘要 |
<p>A radio frequency identification (RFID) tag (200) on a single layer substrate comprises a semiconductor integrated circuit RFID tag device (202) and antenna circuit (106). A connection jumper (206) may be used to bridge over the antenn circuit coil turns (108). The RFID tag device is located on the same side as an inductor coil (108) and capacitor (110) which forms a parallel resonant antenna circuit. The inductor coil (108) has an inner end (210) and an outer end (212). The inner (210) or outer end (212) may be connected directly to the RFID tag device and the outer or inner end (210, 212) be may connected to the RFID tag device with a jumper (206) over the inductor coil turns, or the RFID tag device may bridge the inductor coil turns when being connected to both the inner and outer ends (210, 212). An encapsulation (glop top) may be used to seal the RFID tag device and jumper, and an insulated coating may be used to cover the entire surface of the substrate to create an inexpensive 'chip-on-tag.' The encapsulation may be epoxy, plastic or any protective material known to one of ordinary skill in the art of electronic circuit encapsulation. The insulated coating may be of any type suitable for the applicaiton of use of the RFID tag.</p> |
