NANO-SILVER COLLOIDAL CATALYST COMPOSITION FOR ELECTROLESS CUPPER PLATING, MAKING METHOD THEREFOR, AND ELECTROLESS CUPPER PLATING METHOD USING THE SAME

摘要

The present invention relates to a technology for an Ag catalyst able to replace a Pd catalyst, which forms a nano Ag colloidal catalyst by producing colloids while dispersing Ag in nano size using organic dispersing contained material. The nano Ag colloid provides activity more than that of the Pd catalyst. Further, Ag does not create bridge, and production yield of a printed circuit board product having a microcircuit can be greatly increased. The nano Ag colloid dispersed in nano size and contained by the organic contained material can prevent a flocculation phenomenon and can cause less oxidation to increase stability of liquid, thus increase the life time of a bath. As a result, the nano Ag colloid is suitable for horizontal spray equipment.