| 摘要 |
<p>PURPOSE:To bond semiconductor chips uniformly and accurately, in the manufacture of the semiconductor device, which has a process of bonding semiconductor chips on to the die-pads of lead frames with an adhesive. CONSTITUTION:Prior to the division of a semiconductor wafer into semiconductor chips by dicing, a sheet-shaped adhesive 2 is stuck all over the rear of the semiconductor wafer 1, and then the semiconductor wafer and the sheet- shaped adhesive are divided at the same time by dicing so as to get semiconductor chips 5. By bonding these semiconductor chips directly to the die-pads, those can be bonded accurately and uniformly.</p> |
