| 摘要 |
PURPOSE: A ceramic package is provided to improve the attenuation characteristics of the filter low bandwidth by directly connecting the leg to the ground electrode of the foot pad across the castellation. CONSTITUTION: A ceramic package includes a foot pad, a first dielectric layer, a second dielectric layer, a chip(30), a signal junction pad(40), a ceramic body(80), a castellation(90) and a lead(50). A bottom ground pattern of the strip line, a ground terminal and a signal terminal are formed on the foot pad. The first dielectric layer is formed on the top of the signal pattern of the strip line and the second dielectric layer is formed on the top of the ground pattern of the strip line. The chip(30) is formed on the top of the ground pattern. The signal junction pad(40) is connected to the wire to transmit the signal of the chip(30). The ceramic body(80) is provided with a fault for forming the signal junction pad(40) and a reception groove for receiving the chip(30). The castellation(90) connects the ground electrode with the ground electrode of the bottom foot pad. And, the lead(50) is provided with a plurality of legs in the form of column for connecting the connection path of the castellation(90). |
