| 摘要 |
PROBLEM TO BE SOLVED: To provide a package mold which effectively inhibits the intrusion of solder flux into a recessed part of the package mold when used for a light-emitting device, and inhibits the occurrence of resin mold burrs in the recessed part.SOLUTION: A package mold of the present invention comprises: a resin mold having a recessed part for enclosing a light-emitting component on an upper surface; and a lead which is partially exposed on a bottom surface of the recessed part of resin mold, is extended through a lower side of a side wall forming the recessed part, and is electrically connected to the light-emitting component. The lead includes a groove part formed on a lead surface along at least one part of the side wall. The groove part includes an inner side upper edge and an outer side upper edge, and the inner side upper edge is exposed in the bottom surface of the recessed part. The groove part is filled with the resin mold so that the outer side upper edge is embedded in the resin mold.SELECTED DRAWING: Figure 2 |
