| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing device for performing polishing work in the state of upper and lower plates being in close contact even when influenced by thermal deformation during work. <P>SOLUTION: In the polishing device, the upper plate 101 is suspended from a suspension plate 1a via a wire 7. The wire 7 is bridged to be approximately parallel to a line perpendicular to the polishing surface of the lower plate 102 between a suspension plate inside pulley 3 and an upper plate inside pulley 5 and between a suspension plate outside pulley 4 and an upper plate outside pulley 6. The upper plate 101 is suspended in the shape of a double circle at a number of places on inner and outer diameter circles and held not to be deformed, and the upper and lower plates 101, 102 are kept parallel. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
