| 摘要 |
PURPOSE: To provide a technique which can connect each electrode accurately to a corresponding conductive terminal, in case of drawing out a plurality of electrodes made at small pitches at a semiconductor chip. CONSTITUTION: A wiring board 1 is prepared in which conductive terminals 38 are made at the other main surface at pitches larger than the pitches of conductive terminals 3A made at one main surface. A semiconductor chip 12 is mounted, connecting the conductive terminals 38 at large pitches to the corresponding conductive terminals 15. Hereby, in case of drawing out a plurality of electrodes 14 made at small pitches at a semiconductor chip 12, they can be drawn out at enlarged pitches, so each electrode 14 can be connected accurately to corresponding conductive terminals 15. |
