| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a double-sided wiring board, a multilayer wiring board and a multilayer wiring board with a built-in circuit board by relaxing or eliminating the problem that an insulating sheet is melted and that the shape of a via hole is distorted so as to easily dislocate its position when the insulating sheet having a conductive paste inside the via hole is laminated and thermocompression-bonded so as to manufacture the wiring boards. <P>SOLUTION: In insulating sheets 100 used to manufacture each wiring board, the conductive paste filled into the via hole formed by passing the insulating sheets is provided as via-hole conductors 101, and the hardening start temperature of the conductive paste is lower than the melting start temperature of the insulating sheet. <P>COPYRIGHT: (C)2003,JPO</p> |
