发明名称 Label production method
摘要 Provided is a label production method capable of significantly reducing production costs by producing many single labels using one member. A label substrate that an adhesive and a release agent are applied to is passed through a laminating device twice, first label substrate passed for the first time and second label substrate passed for the second time are pseudo-adhered by joining the release agent of the first label substrate passed for the first time to the adhesive of the second label substrate passed for the second time, and single labels are punched out from the second label substrate by a cutting tooth of a punching device at a position on the downstream side after the label substrate is passed through the laminating device for the second time. The first label substrate passed for the first time is used as a seat for the cutting tooth of the punching device.
申请公布号 US9365012(B2) 申请公布日期 2016.06.14
申请号 US201214381346 申请日期 2012.03.02
申请人 WE'LL CORPORATION 发明人 Nakamura Hiroshi
分类号 B32B37/02;B32B37/22;B32B37/26;B32B38/04;B32B38/10;B31D1/02;B42D25/40;B32B38/00;B26F1/40;B32B38/18 主分类号 B32B37/02
代理机构 Typha IP LLC 代理人 Typha IP LLC
主权项 1. A label production method for producing labels using one type of label substrate, comprising: simultaneously passing, through a laminating device, a preceding label substrate passing through the laminating device for a second time and a succeeding label substrate passing through the laminating device for a first time; pseudo-adhering the preceding label substrate to the succeeding label substrate by the laminating device with a release agent applied to one of the preceding and succeeding label substrates and an adhesive applied to the other of the preceding and succeeding label substrates being joined together by the simultaneous passing through the laminating device of the preceding label substrate and the succeeding label substrate; and punching out a single label from the preceding label substrate by a cutting tooth of a punching device in the pseudo-adhered state while using the succeeding label substrate as a seat in the punching of the preceding label substrate.
地址 Hakusan-shi JP
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