Light emitting device package and manufacturing method thereof

摘要

A light emitting device (LED) package and a manufacturing method thereof are provided. The LED package includes an LED including a first electrode pad and a second electrode pad disposed on one surface thereof; a bonding insulating pattern layer configured to expose the first electrode pad and the second electrode pad; a substrate including a via hole bored from a first surface to a second surface and a wiring metal layer formed on an inner surface of the via hole to extend to a part of the second surface; and a bonding metal pattern layer bonded to the wiring metal layer exposed through the via hole at the first surface of the substrate and also bonded to the first electrode pad and the second electrode pad.

主权项

1. A light emitting device (LED) package, comprising:
a substrate comprising a via hole bored from a first surface to a second surface and a wiring metal layer formed on an inner surface of the via hole to extend to a part of the second surface; a bonding metal pattern layer connected with the wiring metal layer; an LED comprising a first nitride-based semiconductor layer, an active layer, a second nitride-based semiconductor layer, and an electrode pad, wherein the electrode pad is disposed between the second nitride-based semiconductor layer and the substrate; a phosphor layer disposed on the first nitride-based semiconductor layer, and a lens unit disposed on the phosphor layer; wherein the lens unit and the substrate are substantially the same in size.