| 摘要 |
PROBLEM TO BE SOLVED: To eliminate collateral work such as the setting work of polishing conditions by continuously detecting the polishing degree of the wafer substrates during polishing process and by preventing occurrence of dispersion of flatness in respective wafer substrates. SOLUTION: The holding disk 4 of a pressing head portion of a polishing apparatus holds the back surface of a wafer substrate 6, while pressing the polishing surface of the wafer substrate 6 to the grinding wheel 7 or the abrasive cloth of a platen portion 9. Then, the holding disk 4 is upwardly lifted by a stroke in proportion to the degree of pressing provided by a bellows-like spring 5 securing the holding disk 4, and the vertical level of the holding disk is detected by a displacement detecting portion 2 within the pressing head 1 so that polishing is started after the vertical level is identified as the standard level in starting polishing. With the change in polishing degree of the wafer substrate 6, the location of the holding disk 4 also changes following the polishing degree, so that the displacement is continuously measured at the displacement detecting portion 2 in order to recognize the polishing degree based on measured data, allowing to automatically control the final point of polishing. Accordingly, dispersion of flatness respective wafer substrates 6 can be prevented. |
