| 摘要 |
PROBLEM TO BE SOLVED: To enable a bi-level injection molded lead frame to be automatically and mechanically manufactured and markedly lessened in manufacturing cost, by a method wherein the lead frame is trimmed and formed, a die is attached to the lead frame, wires are bonded from the die to the lead frame, and a diffusant film is applied. SOLUTION: A lead frame is trimmed and formed in a step 10. A die is attached to the lead frame, and a mounted part is checked in a step 20. Wires are bonded to the die, and a bonding state is checked in a step 30. Silicone is inserted to an assembly in a step 40. A diffusant film is provided traversing the opening of a cavity in a step 50. An assembly is tested in a step 60. The assembly is marked and stored in a step 70. The assemblies are integrated in a step 80. As mentioned above, component parts and assembly processes required for forming a light emitting diode are lessened in number, whereby automation and mechanization can be realized at a high level. In addition, a manufacturing cost can be markedly reduced as a whole. |
