| 摘要 |
PROBLEM TO BE SOLVED: To process a peripheral edge of a substrate adequately while suppressing the deposition of a liquid to a substrate surface by a technique for processing a peripheral edge of a substrate by irradiating the substrate peripheral edge with laser light.SOLUTION: A substrate processing device 1 comprises: liquid-holding means 51 for holding a liquid Lq with a top face of the liquid opened; substrate-holding means 2 for holding a substantially circular plate-like substrate W with its principal face inclined with respect to a horizontal plane, and immersing a part of a peripheral edge Wp of the substrate W, including a bottom part in a vertical direction, in the liquid from the liquid top face; and laser irradiation means 4 for causing laser light L1 to impinge on the immersed part of the peripheral edge of the substrate W, immersed in the liquid, through the liquid, thereby processing the peripheral edge Wp.SELECTED DRAWING: Figure 1 |
