发明名称 PRINTED WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a printed wiring board which has fine-wiring wirability and insulation reliability. Ž<P>SOLUTION: The printed wiring board includes wiring and an insulating material and has substantially no electroless plating catalyst between wiring lines of the printed wiring board, and is characterized in that the ratio X/Y of a wiring thickness X to an insulating layer thickness Y is 0.01 to 0.5. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010021302(A) 申请公布日期 2010.01.28
申请号 JP20080179688 申请日期 2008.07.10
申请人 KANEKA CORP 发明人 SHIMOOSAKO KANJI
分类号 H05K1/02;H05K1/03;H05K3/10;H05K3/18 主分类号 H05K1/02
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