METHOD OF MANUFACTURING OPTICAL DEVICE CHIP

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing an optical device chip capable of enhancing the light extraction efficiency of the optical device chip.SOLUTION: A method of dividing an optical device wafer (11) to manufacture a plurality of optical device chips comprises: a laser processed groove forming step of irradiating an optical device wafer with a laser beam (L1) having an absorptive wavelength, and forming a pair of laser processed grooves (19) having a V-shaped cross-section orthogonal to a division scheduled line along the division scheduled line on the back surface (11b) side of the optical device wafer; a V-shaped groove forming step of crushing and removing an optical device wafer existing in a region between a pair of laser processed grooves by a cutting blade (14) to form a V-shaped groove (21); a polishing step of polishing the inner wall surface of the V-shaped groove along the V-shaped groove by using a polishing pad (22) formed of a resin or nonwoven fabric and a slurry (23); and a dividing step of generating a crack (27) between the V-shaped groove and the division scheduled line and dividing the optical device wafer into individual optical device chips along each division scheduled line.SELECTED DRAWING: Figure 1