Method and an arrangement relating to the encapsulation of a component

摘要

With the intention of rendering a component impervious to washing liquid while preventing the occurrence of a pressure difference between the interior of the encapsulated component and outside the component, a small hole (6), a microhole, is formed in the component encapsulating casing. The provision of at least one such microhole in the casing encapsulate the component enables gas to flow through while preventing the throughflow of liquid. This permits a circuit board loaded with such encapsulated components to be washed. Practical tests and calculations have shown that an effective hole diameter in this regard is from 10-50 mum, for instance 30 mum, in order for the encapsulated component to be liquid impervious while unaffected by pressure. The diameter of the hole will depend on the use of the encapsulated component.