| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component mounting method realizing high-speed mounting of a component. <P>SOLUTION: A mounting head 11 is moved to a component supply position B to hold a supplied component 2 therein, during which a recognition head 21 having a component recognizing means 24 and a substrate recognizing means 25 is moved onto a substrate 15 to recognize a component mounting position on the substrate 15 by the substrate recognizing means 25. Then, the mounting head 11 and the recognition head 21 are moved to a component recognition position D between the component supply position B and the substrate 15 to recognize the component 2 by the component recognizing means 24. Then, the recognition head 21 is retreated and the mounting head 11 is moved onto the substrate 15 to mount the component 2 on the substrate 15. <P>COPYRIGHT: (C)2009,JPO&INPIT |
